Description |
• | Various devices containing semiconductor are used in HPCU. And heat is generated when the HPCU operates. |
• | These devices are connected to the high voltage directly and cause heat hotter than the electrical devices of an internal combustion engine. |
• | Overheat reduces the efficiency of control devices, hindering operational control. Also, the semiconductor elements may melt under excessive heat (The device may remain constantly turned on.) Such overheat may become the cause of vehicle malfunction. |
Hybrid Motor Cooling System Circuit |
1. Door lock/unlock button
2. Driver position memory system
3. Side view mirror control switch
4. Central door lock switch